Infrastructure Assets

Advanced 55,000 Sq Ft Manufacturing Plant

Our wholly owned, two-storey semi-detached factory facility in Taman Batik, Sungai Petani is purpose-built to scale automated contract assembly safely.

Total Footprint
55,000 Sq Ft

Wholly owned two-storey semi-detached facility optimized for concurrent SMT and box-build assembly pipelines.

Controlled Environment
Cleanroom Class 100K

Dedicated climate and airborne particulate controlled cleanroom environment for high-reliability component rework and repair.

Production Scaling
Flexible Work Cells

Asymmetric floor architecture supporting rapid configuration changes from low-volume prototypes to high-volume OEM mass production.

Regulatory Compliance
IPC Aligned Layout

Production stations and static dissipation zones built strictly to global IPC-A-610 electronic assembly workmanship standards.

D E S Electronics Production Facility Layout
Quality & Accreditation

Internationally Recognised Standards

DES Electronics holds ISO 9001:2015 certification issued by TÜV NORD and is an active IPC member — demonstrating our commitment to consistent quality management and industry best practices.

Quality Standard
ISO 9001:2015 — TÜV NORD Certified

Scope: Provision of Printed Circuit Board (PCB) Assembly. Certified since 2016.

Quality Standard
IPC Member — No. 2467131

Active Global Electronics Association member. Recognised as a manufacturing success story driving IPC standards adoption in Malaysia.

Infrastructure & Capabilities

Advance Production Equipment

01 / Inbound Logistics & Storage System

Unicomp CX7000L X‑Ray SMD Chip Counter

Non‑destructive counting of components inside sealed reels, trays or tubes; no packaging opening needed; fast and accurate inventory verification.

Specifications:

Counts all standard SMD sizes; supports reel diameters up to 500mm; accuracy >99.9%; high‑speed scanning; real‑time result display

IMS Incoming Material Station 2.0

Automated SMT material receiving, barcode verification and inventory registration.

Specifications:

Maximum reel diameter of 15 inches (381 mm).

Juki ISM3600 Automated Smart Component Storage System

Intelligent storage, retrieval, humidity control and inventory tracking; eliminates material errors.

Specifications:

Up to 3,600 storage locations (configuration dependent); real‑time monitoring.

02 / Production & Assembly

RIGHT R460H PCB Laser Marking System

High‑precision permanent marking for identification and traceability; non‑contact processing.

Specifications:

Board size up to 600mm × 500mm; accuracy ±0.01mm

Juki KSP & Right AMA High‑Performance Solder Paste Printers

High-accuracy stencil printing for fine‑pitch and mixed‑technology boards; consistent paste control.

Specifications:

Board size 50mm × 50mm to 510mm × 510mm; accuracy ±12.5μm @ 6σ.

Juki RS-1R & RS-1XL High‑Speed Modular SMT Placement Machines

Precision placement from 01005 chips to large BGA/CSP/QFP; high‑mix, high‑volume support.

Specifications:

Accuracy ±25μm; board size up to 610mm × 560mm; 47,000 CPH (IPC9850 benchmark).

JT JTR-1000D-N 10‑Zone Nitrogen Reflow Oven

10-zone nitrogen reflow oven with precise thermal profile control for lead-free and high-reliability PCB assemblies.

Specifications:

Temperature uniformity ±1°C; board width up to 510mm; speed 0.2–2.0m/min

KSM ANW-1NL Advanced Selective Wave Soldering

Selective soldering system for through-hole assemblies with programmable soldering parameters, ensuring consistent solder quality while minimizing thermal impact on surrounding components.

Specifications:

Board size up to 800mm × 600mm; programmable parameters

FLEX-400 Precision Selective Soldering Machine

Selective soldering system for through-hole assemblies with programmable soldering parameters, ensuring consistent solder quality while minimizing thermal impact on surrounding components.

Specifications:

Board size up to 400mm × 400mm; programmable parameters

ZM-R6200 BGA Rework Station

Precision replacement and repair of BGA, CSP, QFP; controlled heating; no damage to PCB.

Specifications:

Board size up to 620mm × 450mm; temperature accuracy ±1°C; Supports rework of BGA, CSP, QFN and QFP packages.

CNC PCB Depaneling Machine

High-precision CNC routing for clean, stress-free separation of PCBs; supports complex shapes and tab-routed designs; avoids component damage.

Specifications:

Panel size up to 600mm × 500mm; accuracy ±0.01mm; speed up to 800mm/s; board thickness 0.5–3.2mm.

KSM-M30R-99 N2 Generator Machine

On-site high-purity nitrogen supply for reflow and soldering processes, reducing oxidation and improving solder joint consistency and long-term reliability.

Specifications:

Output 30 Nm³/h; purity ≥99.99%; pressure 0.4–0.7 MPa; dew point ≤ -45°C; 24/7 operation.

03 / Inspection & Testing Systems

Keyence VHX‑7000 Digital Microscope

High‑magnification 2D/3D observation and measurement; clear imaging of micro‑features, solder joints and surface quality.

Specifications:

Magnification up to 5,000×; automatic depth composition; 2D/3D dimensional measurement; high-resolution image capture.

Keyence IM‑8020 Image Dimension Measurement System

Fast, automatic 2D measurement of multiple dimensions in one step; high accuracy and repeatability.

Specifications:

Field of view up to 200mm × 100mm; accuracy ±1μm; Automatic measurement of up to 999 dimensions in a single inspection cycle.

Easson LSP‑ 6050 Vision Measuring System

Automated Video Measuring System (VMS) for high-precision quality control inspection.

Specifications:

Travel range (X/Y/Z): 600 × 500 × 200 mm; resolution 0.1 µm; non-contact vision measurement; table load up to 50 kg.

ESPEC SU-642 Thermal Shock Chamber.

High-performance, space-saving environmental chamber for precise temperature testing.

Specifications:

Volume up to 64 Liters; Temperature range -40°C to +150°C; 2.5 °C/min heating; 1.0 °C/min cooling; IEC 60068 3-5 Compliant.

Parmi SIGMAX L 3D Solder Paste Inspection (SPI) Systems

Full 3D volumetric inspection; verifies paste volume, height, position; Enables early process control by identifying solder paste defects before component placement.

Specifications:

Board size up to 700mm × 600mm; resolution 10μm; High-speed inline 3D solder paste inspection.

Mirtec MV-3U OMNI & MV-3U OMNI 2D & 3D Automated Optical Inspection (AOI) Systems

2D + 3D inspection; detects missing parts, solder defects, placement errors.

Specifications:

Board size up to 700mm × 600mm; 3D accuracy ±5μm; High-speed inline inspection.

EFP SCAN 2200 3D X‑Ray Inspection System

Non‑destructive inspection for hidden joints (BGA, QFN); detects voids, misalignment, cold joints.

Specifications:

Board size up to 650mm × 650mm; magnification 500×; resolution 1μm.

Emerix TK-2Xe Flying Probe Tester

Fixtureless flying probe testing for vision. continuity, VI Impedance, component verification, voltage/current (Power On) and open/short detection.

Specifications:

Board size up to 440mm × 470mm; 2 probes; high‑density circuit support.

04 / Cleaning & Protection

ICT-DI-250 Industrial‑Grade Deionized Water Generator

Generates ultra‑pure DI water (18.2 MΩ·cm); ensures residue‑free cleaning.

Specifications:

250 liters/hour; meets ASTM Type 1 standards

ICT-5600 Full Automated PCBA Cleaning System

Fully automated cleaning; removes flux, oils, contaminants; meets IPC cleanliness standards.

Specifications:

Board size up to 700mm × 600mm; 800 boards/hour

ICT-T550 Automated Selective Conformal Coating Machine

Selective automated coating; protects against moisture, dust, chemicals, and temperature.

Specifications:

Board size up to 750mm × 650mm; thickness 25–200μm; Compatible with acrylic, silicone, polyurethane and UV-curable conformal coatings.

Engineering Disciplines

Our team covers a wide variety of expertise in electrical, electronic, and mechanical fields.

Circuit & Schematic Design

Analog and digital circuit design, schematic capture, and component selection optimised for performance, cost, and manufacturability.

PCB Layout & Routing

Multi-layer PCB layout and routing, including high-frequency, high-current, and mixed-signal board designs.

Embedded Firmware Development

Microcontroller and EPROM firmware development for industrial controls, consumer electronics, and IoT applications.

Test Jig & Fixture Engineering

In-house design and fabrication of functional test jigs, ICT fixtures, and automated test equipment adaptors.

Mechanical & Enclosure Design

Mechanical enclosure design, mould fabrication, and plastic part production to complete the full box-build product.

Quality & Inspection Systems

Visual inspection, automated optical inspection (AOI), functional testing, and ISO 9001:2015 compliant documentation and traceability.